Chemicals for printed circuit boards

  
 

Candor is marketing products from leading suppliers of the world of processes for manufacture of printed circuit boards and soldering.

Our product program covers electroless and electrolytic process steps of manufacturing of printed circuit boards from hole metallization to finished boards. Most of our chemicals are produced by Dow Electronic Materials and include:
 
 
 

Hole metallization - Circuposit 3350-1, a stable electroless copper system. Conductron DP, palladium based direct metallization process
 

Imagin - Dry film for etching and plating


Plating - Copper Gleam and SolderOn, electrolytic copper and tin

Etching, stripping and oxide - several processes for different treatment steps

Resist and Coating - Ronascreen OPSR, photo sensitive soldermask for screen-, curtain and Electrostatic applikation. Resistor Pastes and Condutive Pastes from Electra Polymers.

Solderable finish - electroless nickel/gold, palladium, OSP and processes for hot air levelling

And also: SN100C for HASL. Read Keith Sweatman's article here!